"The expo is a unique platform to present the latest technologies and solutions, and engage customers and partners. It is also 'harvest' time to sign agreements with customers or confirm strategic partnerships and purchasing intentions," she said.

In particular, Chia noted that the rapid advancement of artificial intelligence in China is driving a sweeping transformation across industries. While creating tremendous opportunities, it is also pushing thermal management to its limits.

With computing demands growing exponentially, markets across the AI ecosystem require innovative cooling technologies and thermal management materials that can effectively handle heat loads while delivering long-term reliability and sustainability, she added.

At this year's CIIE, Dow showcased a range of thermal management materials and solutions — including thermal interface materials designed to enable efficient heat dissipation for server chips and optical modules.

In addition to bringing new technologies and products to the Chinese market, Dow has also been enhancing its local innovation and production capabilities, and earlier this month opened its first Cooling Science Studio at the Shanghai Dow Center.